US Patent Issued to ROHM on Sept. 30 for "Semiconductor device and method of manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,443, issued on Sept. 30, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device and method of manufacturing the semiconductor device" was invented by Kazuki Yoshida (Kyoto, Japan) and Hajime Kataoka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor element that includes an element main body having an element main surface and an element back surface facing opposite sides to each other in a thickness direction, and a first electrode arranged on the element main surface; an insulator that has an annular shape overlapping an outer peripheral edge of the first electrode when viewed...