ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,455, issued on Sept. 30, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Takara Kosaka (Kyoto, Japan) and Kazuo Egami (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor element; a support member; a bonding layer interposed between the semiconductor element and the support member; and a sealing resin that covers the semiconductor element and at least a portion of the support member, wherein the bonding layer is a layer in which a layer containing first metal and a layer containing second metal are integrated without going through a molten state, and where...