ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,908, issued on Sept. 2, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor module" was invented by Kohei Tanikawa (Kyoto, Japan) and Kenji Hayashi (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a supporting substrate, a conductive substrate supported by the supporting substrate, a conductive bonding member provided between the supporting substrate and the conductive substrate, and a semiconductor element electrically bonded to an obverse surface of the conductive substrate and having a switching function. The conductive bonding member includes a metal base layer, a first layer, and a second lay...