ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,691, issued on Oct. 28, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Yuji Ishimatsu (Kyoto, Japan), Kenji Hama (Kyoto, Japan) and Hideo Hara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a conductive section, a sealing resin, and a conductive section wire. The substrate includes a substrate obverse face and a substrate reverse face oriented in opposite directions to each other in a thickness direction. The conductive section is formed of a conductive material and located on the substrate obverse face. The conductive section includes a first section an...