ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,118, issued on Nov. 4, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Kenji Hama (Kyoto, Japan), Yuji Ishimatsu (Kyoto, Japan) and Hideo Hara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a conductive portion, a sealing resin, a plurality of semiconductor chips, and a plurality of temperature detection elements. The substrate has a substrate obverse surface and a substrate reverse surface that face opposite sides in a thickness direction. The conductive portion is formed on the substrate obverse surface. The sealing resin covers at least a part of the su...