ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,120, issued on Nov. 4, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Kenji Hayashi (Kyoto, Japan), Takumi Kanda (Kyoto, Japan) and Noriaki Kawamoto (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first die pad having a main surface, a second die pad having a second main surface, a first switching element connected to the first main surface, a second switching element connected to the second main surface, a first connecting member connecting the first main surface electrode of the first switching element to the second die pad, an encapsulation resin encapsulating the...