ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,161, issued on Nov. 18, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor package with lead frame" was invented by Ryuta Kimura (Kyoto, Japan) and Yosui Futamura (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device including: a first lead; a first semiconductor element mounted on the first lead; and a sealing resin that covers the first semiconductor element, wherein the first lead includes a first die pad, a second die pad, a third die pad, a first connecting portion, and a second connecting portion, wherein the first die pad has a first main surface and a first back surface facing opposit...