ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,169, issued on Nov. 18, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Tomonori Tanioka (Kyoto, Japan) and Kazuo Egami (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided, which is configured to improve the adhesion between the resin part and the leads without interfering with proper operation of the semiconductor device. The semiconductor device includes a semiconductor element 1, a first lead 2 including a first pad portion 21, a second lead 3 including a second pad portion 31, a conductor member 61, and a resin part 8. The first pad portion 21 has a first-pad obvers...