ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,162, issued on Nov. 18, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Yuki Nakano (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor layer that includes a semiconductor substrate having a first thickness and has a main surface, a main surface electrode that is arranged at the main surface and has a second thickness less than the first thickness, and a pad electrode that is arranged on the main surface electrode and has a third thickness exceeding the first thickness."
The patent was filed on April 30, 2021, under Application No. 17/801,798.
*For furthe...