US Patent Issued to ROHM on March 25 for "Semiconductor device including lead with varying thickness" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,094, issued on March 25, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device including lead with varying thickness" was invented by Ryota Majima (Kyoto, Japan) and Koshun Saito (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a first lead electrically connected to the semiconductor element, a sealing resin that covers the semiconductor element and a part of the first lead, and a recess formed in a surface flush with a back surface of the sealing resin. The sealing resin also has a front surface opposite to the back surface in a thickness direction, and a side surfa...