ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,191, issued on March 18, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Hideki Sawada (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device comprising: a semiconductor element; a supporting board supporting the semiconductor element; a wiring unit electrically connected to the semiconductor element; and a resin member sealing the semiconductor element. The resin member is provided with a first driving-side opening part, a second driving-side opening part, a first control-side opening part, and a second control-side opening part, in which a part of the wiring unit is exp...