US Patent Issued to ROHM on June 24 for "Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,120, issued on June 24, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer" was invented by Shoji Takei (Kyoto, Japan) and Yuji Koga (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor layer having a first surface, an insulating layer formed at the first surface of the semiconductor layer, a Cu conductive layer formed on the insulating layer, the Cu conductive layer made of a metal mainly containing Cu, a second insulating layer formed on the insulating layer, the second insulating layer covering the Cu...