US Patent Issued to ROHM on June 17 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,466, issued on June 17, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor module" was invented by Kenji Hayashi (Kyoto, Japan), Kohei Tanikawa (Kyoto, Japan) and Ryosuke Fukuda (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutu...