US Patent Issued to ROHM on June 10 for "Semiconductor device including a lead and a sealing resin" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,780, issued on June 10, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device including a lead and a sealing resin" was invented by Tomonori Tanioka (Kyoto, Japan) and Kazuo Egami (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a lead having a main surface facing in a thickness direction; a semiconductor element mounted over the main surface; and a sealing resin that is in contact with the main surface and covers the semiconductor element, wherein the lead is formed with a plurality of grooves that are recessed from the main surface and are located apart from each other, and whe...