ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,981, issued on July 8, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device and method for manufacturing the same" was invented by Koshun Saito (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a predetermined number of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin that covers the semiconductor element and a part of each lead. Each lead includes some portions exposed from the sealing resin. A surface plating layer is formed on at least one of the exposed portions of the respective leads."
The patent was filed on June ...