ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,047, issued on Dec. 2, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Hideo Hara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a conductive part formed on a front surface of the substrate, a semiconductor chip disposed on the front surface of the substrate, a control unit that controls the semiconductor chip, a sealing resin that covers the semiconductor chip, the control unit and the conductive part, and a first lead bonded to the conductive part and partially exposed from the sealing resin. The conductive part includes a first pad and a second pad disp...