ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,868, issued on Aug. 12, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device and semiconductor module" was invented by Kosei Osada (Kyoto, Japan), Isamu Nishimura (Kyoto, Japan), Tetsuya Kagawa (Kyoto, Japan), Daiki Yanagishima (Kyoto, Japan), Toshiyuki Ishikawa (Kyoto, Japan), Michihiko Mifuji (Kyoto, Japan), Satoshi Kageyama (Kyoto, Japan) and Nobuyuki Kasahara (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor device of the present invention includes an insulating layer, a high voltage coil and a low voltage coil which are disposed in the insulating layer at an interval in the vertical direction, a low p...