ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,739, issued on April 29, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device and method for manufacturing the same" was invented by Motoharu Haga (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a mount portion, and a sintered metal bond. The semiconductor element includes a body and an electrode pad. The body has an obverse surface facing forward in a first direction and a reverse surface facing rearward in the first direction. The electrode pad covers the element reverse surface. The mount portion supports the semiconductor element. The sintered metal bond electric...