ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,573, issued on April 22, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor power module" was invented by Kenji Hayashi (Kyoto, Japan) and Masashi Hayashiguchi (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applie...