US Patent Issued to ROHM on April 22 for "Semiconductor device, method of manufacturing semiconductor device, and module" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,540, issued on April 22, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Semiconductor device, method of manufacturing semiconductor device, and module" was invented by Bin Zhang (Kyoto, Japan), Akinori Nii (Kyoto, Japan) and Taro Nishioka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the ...