US Patent Issued to Rohm and Haas Electronic Materials CMP Holdings on Oct. 21 for "Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,581, issued on Oct. 21, was assigned to Rohm and Haas Electronic Materials CMP Holdings Inc. (Newark, Del.).

"Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features" was invented by Bainian Qian (Newark, Del.), Donna M. Alden (Bear, Del.) and Sheng-Huan Tseng (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad for chemical mechanical polishing comprises a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated prepolymer with a curative, wherein the polymer matrix has hard segments and soft segments wherein multi-lobed polymeric eleme...