US Patent Issued to Rohm and Haas Electronic Materials CMP Holdings on Feb. 10 for "Method of making low specific gravity polishing pads" (Delaware Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,958, issued on Feb. 10, was assigned to Rohm and Haas Electronic Materials CMP Holdings Inc. (Newark, Del.).

"Method of making low specific gravity polishing pads" was invented by Nan-Rong Chiou (Wilmington, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such...