US Patent Issued to Rohm and Haas Electronic Materials CMP Holdings on Dec. 9 for "Chemical mechanical polishing pad" (Delaware Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,604, issued on Dec. 9, was assigned to Rohm and Haas Electronic Materials CMP Holdings Inc. (Newark, Del.).

"Chemical mechanical polishing pad" was invented by Bainian Qian (Newark, Del.) and Marty W. DeGroot (Middletown, Del.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an isocyanate terminated urethane prepolymer; and, a curative system, containing a high molecular weight polyol curative; and, a difunctional curative."

The patent was filed on May 2, 2022, unde...