US Patent Issued to ROHM, ASE JAPAN on Oct. 14 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,667, issued on Oct. 14, was assigned to ROHM Co. LTD. (Kyoto, Japan) and ASE JAPAN Co. LTD. (Yamagata, Japan).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Susumu Fukui (Yamagata, Japan), Takaki Takahashi (Yamagata, Japan), Kanako Deguchi (Kyoto, Japan) and Kentaro Nasu (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first lead, a semiconductor element, a sealing resin, a first plating layer, and a second plating layer. The first lead has a first obverse surface and a first reverse surface facing opposite from each other in a thickness direction and a first re...