ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,157, issued on June 17, was assigned to Rohde & Schwarz GmbH & Co. (Munich).
"Method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board and electromagnetic shield housing" was invented by Simon Pippers (Munich).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board comprises providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board; filling the shielding chamber with an RF-absor...