US Patent Issued to ROGERS GERMANY on Feb. 18 for "Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer" (German Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,226,856, issued on Feb. 18, was assigned to ROGERS GERMANY GMBH (Eschenbach, Germany).

"Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer" was invented by Stefan Britting (Schnaittach, Germany), Tilo Welker (Neuhaus, Germany) and Karsten Schmidt (Eschenbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solder material (30) for bonding a metal layer (20) to a ceramic layer (10), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising: a base material and an active metal, wherein the s...