US Patent Issued to Rockwell Collins on Dec. 9 for "High performance embedded computing interface extensibility module" (Iowa, Texas Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,331, issued on Dec. 9, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"High performance embedded computing interface extensibility module" was invented by Peter W. Jones (Rockwall, Texas), Raymond E. Knoff (Vinton, Iowa) and Martin J. Jennings (Oxford, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A convection cooled chassis providing conduction cooling to components within includes a backplane card that interfaces with an interconnect assembly, and one or more VPX backplane cards, each with a plurality of component interfaces and a backplane card interface to engage the backplane card. Static elements that are not subject to redes...