US Patent Issued to Rockwell Collin on July 1 for "Method and apparatus for through interposer die level interconnect with thermal management" (Iowa Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,762, issued on July 1, was assigned to Rockwell Collin Inc. (Cedar Rapids, Iowa).

"Method and apparatus for through interposer die level interconnect with thermal management" was invented by Reginald D. Bean (Center Point, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly is disclosed. The electronic assembly includes a first attachment layer, a second attachment layer, a first interposer redistribution layer, a second interposer redistribution layer, at least one of a thermal spreader layer or a thermal management layer, and an interposer cavity. The interposer further includes an interconnect header fixed within the interpo...