ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,307, issued on May 20, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).
"Through mold via frame" was invented by Seungjae Lee (Pasadena, Calif.), Brett Sawyer (Pasadena, Calif.) and Gerald Cois Byrd (Shadow Hills, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes."
The patent was filed on July 10, 2020, under Application No. 17/597,473.
*For further information,...