US Patent Issued to Rockley Photonics on July 29 for "Source wafer and method of preparation thereof" (California Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,414, issued on July 29, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).

"Source wafer and method of preparation thereof" was invented by Guomin Yu (Glendora, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A source wafer for use in a micro-transfer printing process. The source wafer comprises: a substrate; a device coupon (110), including an optoelectronic device; and a breakable tether securing the device coupon to the substrate. The breakable tether includes one or more breaking regions which connect the breakable tether to the substrate."

The patent was filed on Jan. 8, 2021, under Application No. 17/791,524.

*For furt...