US Patent Issued to Rockley Photonics on July 1 for "Packaging of three-dimensional integrated circuit by encapsulation with copper posts and double sided redistribution layer" (California, Colorado Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,763, issued on July 1, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).

"Packaging of three-dimensional integrated circuit by encapsulation with copper posts and double sided redistribution layer" was invented by Seungjae Lee (Pasadena, Calif.), Brett Sawyer (Pasadena, Calif.) and David Arlo Nelson (Fort Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package. In some embodiments, the package has a top surface and a bottom surface, and includes: a semiconductor die having a front surface, a back surface, and a plurality of edges; a mold compound, on the back surface of the die and the edges of the die;...