US Patent Issued to Rockley Photonics on Jan. 20 for "Method of preparing a device coupon for micro-transfer printing, device wafer including said device coupon, and optoelectronic device manufactured from said device wafer" (Irish, American Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,574, issued on Jan. 20, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).

"Method of preparing a device coupon for micro-transfer printing, device wafer including said device coupon, and optoelectronic device manufactured from said device wafer" was invented by Guomin Yu (Glendora, Calif.), Mohamad Dernaika (Cork, Ireland), Ludovic Caro (Cork, Ireland), Hua Yang (Cork, Ireland) and Aaron John Zilkie (Pasadena, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of preparing a device coupon for a micro-transfer printing process from a multi-layered stack located on a device wafer substrate. The multi-layered stack compris...