US Patent Issued to Rockley Photonics on Feb. 3 for "Transfer die for micro-transfer printing with non-conductive isolation layer and isolation trench" (Irish, American Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,537, issued on Feb. 3, was assigned to Rockley Photonics Ltd. (Altrincham, Great Britain).

"Transfer die for micro-transfer printing with non-conductive isolation layer and isolation trench" was invented by Hua Yang (Cork, Ireland), Adam Scofield (Los Angeles) and Frank Peters (Cork, Ireland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a transfer die for use in a transfer print process. The manufactured transfer die comprises a semiconductor device suitable for bonding to a silicon-on-insulator wafer. The method comprises the steps of providing a non-conductive isolation region in a semiconductor stack, the semiconductor s...