ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,280, issued on Oct. 21, was assigned to ROBERT BOSCH GMBH (Stuttgart, Germany).
"Bond structures on MEMS element and ASIC element" was invented by Friedjof Heuck (Stuttgart, Germany), Jochen Tomaschko (Gaeufelden, Germany), Peter Schmollngruber (Aidlingen, Germany), Thomas Friedrich (Moessingen-Oeschingen, Germany), Volkmar Senz (Metzingen, Germany) and Mike Schwarz (Viermunden, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A MEMS element is provided. The MEMS element includes: a substrate; a first passivation layer arranged on the substrate; a metal layer arranged on the first passivation layer; a second passivation layer arranged on the m...