US Patent Issued to Robert Bosch on Dec. 30 for "Laser sealing methods for closing ventholes of micromecahnical devices" (German, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,346, issued on Dec. 30, was assigned to Robert Bosch GmbH (Germany).

"Laser sealing methods for closing ventholes of micromecahnical devices" was invented by Bo Cheng (Malden, Mass.), Holger Rumpf (Reutlingen, Germany), Jens Frey (Filderstadt, Germany), Charles Tuffile (Swansea, Mass.), Stephanie Karg (Stuttgart, Germany) and Tobias Joachim Menold (Weil der Stadt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A venthole of a micromechanical device is sealed with laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface, and defines a venthole leading to a chamber that contains a device,...