US Patent Issued to RO TECHNOLOGIES on Oct. 14 for "Thermoform windshield stack with integrated formable mold" (Nevada Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,958, issued on Oct. 14, was assigned to RO TECHNOLOGIES LLC (Las Vegas).

"Thermoform windshield stack with integrated formable mold" was invented by Stephen S. Wilson (Las Vegas), Bart E. Wilson (Las Vegas) and Roger Cone (Las Vegas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Manufacturing a pre-molded stack of one or more lenses to be installable on a curved substrate such as a vehicle windshield includes placing a moldable stack of one or more lenses and adhesive layer(s) on a mold, applying heat and pressure to the moldable stack to produce a pre-molded stack of one or more lenses from the moldable stack, and removing the pre-molded stack from...