US Patent Issued to RICOH on Oct. 21 for "Loop heat pipe, cooling system, electronic equipment, and wick" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,049, issued on Oct. 21, was assigned to RICOH COMPANY LTD. (Tokyo).

"Loop heat pipe, cooling system, electronic equipment, and wick" was invented by Takeshi Endoh (Kanagawa, Japan) and Tomoyasu Hirasawa (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed s...