US Patent Issued to RICHTEK TECHNOLOGY on May 13 for "Chip package unit and chip packaging method" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,565, issued on May 13, was assigned to RICHTEK TECHNOLOGY Corp. (Zhubei, Taiwan).

"Chip package unit and chip packaging method" was invented by Hao-Lin Yen (Taoyuan, Taiwan), Heng-Chi Huang (Hsinchu, Taiwan) and Yong-Zhong Hu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package unit includes: a base material; at least one chip, disposed on the base material; a package material, enclosing the base material and the chip; and at least one heat dissipation paste curing layer, formed by curing the heat dissipation paste, on a top side of the package material or a back side of the chip in a printed pattern."

The patent was fil...