US Patent Issued to RICHTEK TECHNOLOGY on Dec. 30 for "Chip packaging method and chip package unit" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,395, issued on Dec. 30, was assigned to RICHTEK TECHNOLOGY Corp. (Zhubei, Taiwan).

"Chip packaging method and chip package unit" was invented by Hao-Lin Yen (Taoyuan, Taiwan), Heng-Chi Huang (Hsinchu, Taiwan) and Yong-Zhong Hu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each o...