ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,861, issued on Oct. 21, was assigned to RF360 Singapore Pte. Ltd. (Republic Plaza, Singapore).
"Wafer level package" was invented by Robert Felix Bywalez (Munich), Karl Nicolaus (Zorneding, Germany), Ilya Lukashov (Munich) and Luis Maier (Munich).
According to the abstract* released by the U.S. Patent & Trademark Office: "A fullcover package solution in combination with copper pillars or solder bumps and acoustic cavities is proposed to provide maximum usable design area compared to current thin film acoustic wafer level packages. Manufacturing can be done in a self-aligned interconnection process."
The patent was filed on Oct. 30, 2020, under Application No. 17/770,982.
*For f...