US Patent Issued to RF360 Singapore on March 25 for "Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods" (Austrian, German Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,583, issued on March 25, was assigned to RF360 Singapore Pte. Ltd. (Singapore).

"Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods" was invented by Simone Colasanti (Bayern, Germany), Nadine Erhard-Egeler (Munich), Stefan Leopold Hatzl (Kloech, Austria), Manuel Hofer (Graz, Austria), Peter Kirchhofer (Munich) and Volker Schulz (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second subs...