US Patent Issued to RF360 Singapore on June 17 for "Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods" (Austrian, German, Dutch, French Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,909, issued on June 17, was assigned to RF360 Singapore Pte. Ltd. (Singapore).

"Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods" was invented by Manuel Hofer (Graz, Austria), Xavier Perois (Mouans Sartoux, France), Michael Wick (Munich), Jeroen Bielen (Molenhoek, Netherlands), Stefan Leopold Hatzl (Kloech, Austria) and Juergen Portmann (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-level stacked AW filter package including a first acoustic wave (AW) filter stacked on a second AW filter employs semiconductor fabrication methods and structures, including a metallization layer comprising interconne...