ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,422, issued on July 8, was assigned to RF360 Singapore Pte. Ltd. (Republic Plaza, Singapore).
"Saw device with improved thermal management" was invented by Kamran Cheema (Apopka, Fla.), Bambang Kunardi (Singapore), Yu Jen Chong (Singapore) and Chong Choon Lee (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects herein include minimizing hot spots on a filter chip by creating thermal radiators using mechano-acoustic structures and connection circuitry. A gradual increase of metal to wafer relation provides better heat dissipation and heat sinking. Shunt lines of a ladder type arrangement of SAW resonators comprise a broadened section. Res...