US Patent Issued to Resonac Packaging on May 20 for "Laminated body for power storage device outer packaging material" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,452, issued on May 20, was assigned to Resonac Packaging Corp. (Hikone, Japan).

"Laminated body for power storage device outer packaging material" was invented by Kenji Yoshino (Isehara, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated body includes a barrier layer made of metal, a base material layer made of a heat-resistant resin laminated on an outer side surface of the barrier layer, and a sealant layer made of a heat sealable resin laminated to an inner side surface of the barrier layer. The base material layer includes a polyester film layer as an outer layer and a polyamide film layer as an inner layer. The polyester film laye...