US Patent Issued to RESONAC PACKAGING on Dec. 16 for "Method of manufacturing laminated armoring material" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,804, issued on Dec. 16, was assigned to RESONAC PACKAGING Corp. (Shiga, Japan).

"Method of manufacturing laminated armoring material" was invented by Koji Minamitani (Hikone, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In laminating resin layers on both surfaces of a metal foil layer by adhering a heat-resistant resin layer to a first surface of the metal foil layer and adhering a heat-sealable resin layer to a second surface thereof, as an adhering method, by employing an adhesive agent unapplied portion forming and adhering process in which the resin layer and the metal foil layer are adhered together by applying an adhesive agent to a re...