ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,397,531, issued on Aug. 26, was assigned to Resonac Packaging Corp. (Hikone, Japan).
"Packaging material" was invented by Keitaro Kawakita (Hikone, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging material includes a substrate layer, a metal foil layer laminated on an inner side of the substrate layer, a sealant layer made of a thermoplastic resin and laminated on an inside of the metal foil layer, and a colored adhesive layer provided between the metal foil layer and the substrate layer. The substrate layer is 2.0 to 5.0% in MD and TD hot water shrinkages, 1.5% or less in a difference between the MD and TD hot water shrinkages, 1.5 to 3...