ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,164, issued on Sept. 23, was assigned to RESONAC Corp. (Tokyo).
"Semiconductor package" was invented by Masaya Toba (Tokyo), Kazuhiko Kurafuchi (Tokyo), Takashi Masuko (Tokyo), Kazuyuki Mitsukura (Tokyo) and Shinichiro Abe (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover th...