US Patent Issued to Resonac on Sept. 2 for "Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,405,198, issued on Sept. 2, was assigned to Resonac Corp. (Tokyo).

"Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device" was invented by Kazuyuki Mitsukura (Tokyo), Yuki Imazu (Tokyo), Yu Aoki (Tokyo) and Takuya Komine (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "method for selecting a photosensitive resin composition exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm2 and heat-treating the resin film at 150deg C. to 5 250deg C. for 1 to 3 hours under nitrogen to produce a strip sample of a ...