US Patent Issued to RESONAC on Oct. 14 for "Thermal conduction sheet holder and method of manufacturing heat dissipating device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,576, issued on Oct. 14, was assigned to RESONAC Corp. (Tokyo).

"Thermal conduction sheet holder and method of manufacturing heat dissipating device" was invented by Mika Kobune (Tokyo), Michiaki Yajima (Tokyo) and Keita Suga (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal conduction sheet holder include, in the following order, an elongated carrier film, a plurality of thermal conduction sheets, and an elongated cover film covering the plurality of thermal conduction sheets, the shortest distance between adjacent thermal conduction sheets is 2 mm or more, the plurality of thermal conduction sheets are disposed at intervals in a longi...