US Patent Issued to RESONAC on Nov. 4 for "Method for manufacturing electronic component device and electronic component device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,191, issued on Nov. 4, was assigned to RESONAC Corp. (Tokyo).

"Method for manufacturing electronic component device and electronic component device" was invented by Tomoaki Shibata (Tokyo), Tsuyoshi Ogawa (Tokyo), Satoshi Yoneda (Tokyo) and Xinrong Li (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for manufacturing an electronic component device, including: preparing a sealing structure having a sealing layer having two opposing main surfaces, an electronic component, and a connection portion, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer; preparing a rewiring stru...